Physical Design
Today, we
are going to discuss physical design briefly. We will learn more on this
subject later one by one under a different heading. And here we go…………
In the
Physical design, all design components in the design are instantiated with
their geometric representations. In other words, all polygonal shapes of each
and every standard cell, memory unit, interconnect, etc., which are fixed in
their shapes and sizes during physical design steps. Once we are done with it,
then GDSII file is released for tape-out.
The physical
design has two major parts, one, derives a layout for a netlist and another
involves analysis and tuning of a design characteristic. Physical design is performed
as per the design rules prescribed by the foundry that represent the physical limitation
of the fab process. Physical design directly impacts on various factors of
design such as area, performance, power and more. We will see these with the
examples –
Area: placing
the cell far apart leads to long interconnect and it will impact on the delay
between the cells.
Power: transistor
with smaller gate length switches faster at cost of higher leakage current.
Reliability:
a large number of vias can reduce the reliability of the design.
Performance:
longer nets have significantly more delay of the signal.
Yield: while
routing nets, routes may place near to one another and it will create EM
related issue. Open shorts might happen during manufacturing. Also, longer nets
undermine yield and has a higher possibility of open.
Physical
design of a project (chip) is performed in several stages. –
In DSM technology,
netlist of a design is longer. We break up netlist into several parts called
blocks. We perform physical design steps on the block-level and at the end, we integrated
blocks into a chip.
Floorplanning
determines the position of macros and IO cell and defines the region for the
placement of standard cells.
Powerplanning
provides the power connection to each cell macros from an external power supply.
Placement provides
automatic placing of standard cell in the region which was provided at the stage
of floorplanning.
CTS
connects the clock pin of the sequential cell to the clock source in order to
minimize clock skew.
Routing
lays down detailed interconnect metal wire from pin to pin. While doing it,
tool take care DRC, LVS and timing constraints.
At this note of discussion, we wrap up this topic and we will meet soon with a new topic of STA. Thank you, Have a nice day!
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